The University of Idaho and Boise State University have secured nearly $8 million in National Science Foundation funding to advance microelectronics research designed for extreme environments. The award supports a new initiative called Capacity Building for Resilient Microelectronics for Extreme Environments, or XTREME.
The project aims to develop materials that can withstand high temperatures, radiation, and mechanical stress. These capabilities are critical for sectors including energy production, national defense, and aerospace engineering. The University of Idaho will receive $2 million of the total award.
Research Focus and Partnerships
Researchers at the University of Idaho will conduct student work at the Critical Materials and Energy Systems Innovation Center on the Idaho Falls campus. The funding connects the university’s Generation Microelectronics Research Center to broader national research priorities.
The XTREME initiative builds upon a 20-year partnership between the universities and the Idaho National Laboratory. It also extends Boise State University’s decade of research conducted at its Micron Center for Materials Research. That center was established in 2015 following a $25 million gift from the Micron Foundation.
Three community colleges—College of Western Idaho, College of Southern Idaho, and College of Eastern Idaho—are partnering in the project. Brigham Young University-Idaho is also involved. The advisory board includes representatives from NASA, the Air Force Research Laboratory at Wright-Patterson Air Force Base, Department of Energy Nuclear Science User Facilities, industry leaders, and R1 universities.
Co-principal investigators on the award include John Russell, Indrajit Charit, Krishna Pakala, and Brian Jaques. The research team is working toward creating microelectronics and sensors capable of surviving temperatures greater than 1,000 degrees Celsius.
Economic Context
The academic partnership aligns with significant private sector investment in Idaho’s technology sector. Micron Technology announced a $50 billion investment in Boise in 2022 to construct two microelectronics fabrication facilities. Construction is expected to take place over the next two decades.
Micron projects the new facilities will employ approximately 2,000 workers on-site. The company estimates the project will indirectly create about 15,000 additional jobs across the state. Micron Technology has also established an endowment to provide permanent research funding for the University of Idaho’s Generation Microelectronics Research Center.
University of Idaho and Boise State University participate in the Strategic University Partnership for Education and Research agreement with the Idaho National Laboratory. This framework supports collaborative efforts between higher education institutions and federal research facilities.
State Leadership
Idaho Congressman Mike Simpson highlighted the significance of the funding for the state’s economic trajectory. He noted that Idaho is demonstrating how a smaller state can lead the nation in technologies vital to security and economic growth.
University of Idaho co-principal investigator John Russell emphasized the institution’s long-standing expertise in material science under extreme conditions. The university has spent decades studying how materials behave when exposed to intense heat, radiation, and physical stress.
The XTREME project represents a continuation of Idaho’s strategy to strengthen its position in the microelectronics supply chain. By combining federal funding with existing industry partnerships, state universities are expanding their capacity to train workers and develop resilient technologies for critical infrastructure needs.